Semiconductor Industry
Customer industry: wire bonding machine, die bonding machine
Main advantages: better responsiveness, greater thrust, and good consistency under the same size
Competitors: Uesugi, Jacobis, Yaskawa, etc
Customer demand: Improve motor consistency to reduce debugging difficulty
| Imported competitors | Zhibo Shidai | |
| Precision | 1μ | 1μ |
| Process error (acceleration) | 20μ(4G) | 15μ(4G) |
| Setting time | 10ms | 10ms |
| Imbalance of inductance | <40% | <30% |
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Contact Us
Contact Number: 13816117284
Email Address：473359865@qq.com
Company Address：No. 28, Ganshao Road, Qingshanhu Street, Lin'an District, Hangzhou City, Zhejiang Province
@Zhibo Shidai (Hangzhou) Technology Co., Ltd.
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